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| Type | Description |
|---|---|
| Series: | - |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | - |
| Fin Height: | 0.275" (7.00mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 8.13°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 15.20°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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HSE-B20635-035HCUI Devices |
HEAT SINK, EXTRUSION, TO-220, 63 |
In Stock: 0 $0.90720 |
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HSE-B20635-035H-01CUI Devices |
HEAT SINK, EXTRUSION, TO-220, 63 |
In Stock: 0 $0.90720 |
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V5236BP-TASSMANN WSW Components |
HEATSINK ANOD ALUM SOT-32/TO-220 |
In Stock: 38 $0.91000 |
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7121DGAavid |
BOARD LEVEL HEAT SINK |
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PH3N-101.6-25.4-0.062-1At-Global Technology |
PH3N NANO 101.6X25.4X0.062MM |
In Stock: 0 $0.92667 |
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HSE-B508-045HCUI Devices |
HEAT SINK, EXTRUSION, TO-220, 50 |
In Stock: 0 $0.93100 |
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HSE-B20635-035H-WCUI Devices |
HEAT SINK, EXTRUSION, TO-220, 63 |
In Stock: 0 $0.93100 |
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624-45ABWakefield-Vette |
HEATSINK CPU 21MM SQ W/OUT ADH |
In Stock: 0 $0.94668 |
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642-25ABWakefield-Vette |
HEATSINK FOR 35MM BGA |
In Stock: 0 $0.94668 |
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254-195ABPEWakefield-Vette |
HEATSINK TO PKG FOLDED FIN |
In Stock: 0 $0.94668 |
