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| Type | Description |
|---|---|
| Series: | PH3n |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Heat Spreader |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Adhesive |
| Shape: | Rectangular |
| Length: | 4.000" (101.60mm) |
| Width: | 1.000" (25.40mm) |
| Diameter: | - |
| Fin Height: | 0.002" (0.06mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | - |
| Thermal Resistance @ Natural: | - |
| Material: | Copper |
| Material Finish: | Polyester |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
 |
HSE-B508-045HCUI Devices |
HEAT SINK, EXTRUSION, TO-220, 50 |
In Stock: 0 $0.93100 |
 |
HSE-B20635-035H-WCUI Devices |
HEAT SINK, EXTRUSION, TO-220, 63 |
In Stock: 0 $0.93100 |
 |
624-45ABWakefield-Vette |
HEATSINK CPU 21MM SQ W/OUT ADH |
In Stock: 0 $0.94668 |
|
642-25ABWakefield-Vette |
HEATSINK FOR 35MM BGA |
In Stock: 0 $0.94668 |
|
254-195ABPEWakefield-Vette |
HEATSINK TO PKG FOLDED FIN |
In Stock: 0 $0.94668 |
|
625-25ABWakefield-Vette |
HEATSINK FOR 25MM BGA |
In Stock: 0 $0.96124 |
 |
HSE-B18317-035H-01CUI Devices |
HEAT SINK, EXTRUSION, TO-218, 31 |
In Stock: 0 $0.95900 |
 |
V2136N1-FASSMANN WSW Components |
HEATSINK CPU W/ADHESIVE STAMPED |
In Stock: 0 $0.96450 |
|
642-35ABWakefield-Vette |
HEATSINK FOR 35MM BGA |
In Stock: 0 $0.97580 |
 |
HSE-B18381-035H-02CUI Devices |
HEAT SINK, EXTRUSION, TO-218, 38 |
In Stock: 0 $0.97020 |
