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| Type | Description |
|---|---|
| Series: | HSE |
| Package: | Box |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.500" (63.50mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | - |
| Fin Height: | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | 9.2W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 4.35°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 8.15°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
 |
624-45ABWakefield-Vette |
HEATSINK CPU 21MM SQ W/OUT ADH |
In Stock: 0 $0.94668 |
|
642-25ABWakefield-Vette |
HEATSINK FOR 35MM BGA |
In Stock: 0 $0.94668 |
|
254-195ABPEWakefield-Vette |
HEATSINK TO PKG FOLDED FIN |
In Stock: 0 $0.94668 |
|
625-25ABWakefield-Vette |
HEATSINK FOR 25MM BGA |
In Stock: 0 $0.96124 |
 |
HSE-B18317-035H-01CUI Devices |
HEAT SINK, EXTRUSION, TO-218, 31 |
In Stock: 0 $0.95900 |
 |
V2136N1-FASSMANN WSW Components |
HEATSINK CPU W/ADHESIVE STAMPED |
In Stock: 0 $0.96450 |
|
642-35ABWakefield-Vette |
HEATSINK FOR 35MM BGA |
In Stock: 0 $0.97580 |
 |
HSE-B18381-035H-02CUI Devices |
HEAT SINK, EXTRUSION, TO-218, 38 |
In Stock: 0 $0.97020 |
|
625-35ABWakefield-Vette |
HEATSINK FOR 25MM BGA |
In Stock: 0 $0.99036 |
|
630-35ABWakefield-Vette |
HEATSINK FOR 35MM BGA |
In Stock: 0 $0.99037 |
