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| Type | Description |
|---|---|
| Series: | - |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | Bolt On and PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.180" (29.97mm) |
| Width: | 1.000" (25.40mm) |
| Diameter: | - |
| Fin Height: | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | 1.0W @ 20°C |
| Thermal Resistance @ Forced Air Flow: | 5.00°C/W @ 400 LFM |
| Thermal Resistance @ Natural: | 13.00°C/W |
| Material: | Copper |
| Material Finish: | Tin |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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PH3N-101.6-25.4-0.062-1At-Global Technology |
PH3N NANO 101.6X25.4X0.062MM |
In Stock: 0 $0.92667 |
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HSE-B508-045HCUI Devices |
HEAT SINK, EXTRUSION, TO-220, 50 |
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HSE-B20635-035H-WCUI Devices |
HEAT SINK, EXTRUSION, TO-220, 63 |
In Stock: 0 $0.93100 |
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624-45ABWakefield-Vette |
HEATSINK CPU 21MM SQ W/OUT ADH |
In Stock: 0 $0.94668 |
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642-25ABWakefield-Vette |
HEATSINK FOR 35MM BGA |
In Stock: 0 $0.94668 |
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254-195ABPEWakefield-Vette |
HEATSINK TO PKG FOLDED FIN |
In Stock: 0 $0.94668 |
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625-25ABWakefield-Vette |
HEATSINK FOR 25MM BGA |
In Stock: 0 $0.96124 |
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HSE-B18317-035H-01CUI Devices |
HEAT SINK, EXTRUSION, TO-218, 31 |
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V2136N1-FASSMANN WSW Components |
HEATSINK CPU W/ADHESIVE STAMPED |
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642-35ABWakefield-Vette |
HEATSINK FOR 35MM BGA |
In Stock: 0 $0.97580 |
