| Image | Part Number | Description |
|---|---|---|
 |
8463-7GMG Chemicals |
GREASE SILVER CONDUCTIVE 0.25OZ |
 |
TG-LH-FBPE-80F-0.75t-Global Technology |
EPOXY POTTING COMPOUND BLACK/YEL |
 |
DP-200-30Taica Corporation |
THERMAL PASTE, 30CC SYRINGE |
 |
TG-NSP25-60t-Global Technology |
SILICONE FREE THERMAL PUTTY 60CC |
 |
TC2-50GChip Quik, Inc. |
HEAT SINK COMPOUND - GREY ULTRA |
 |
S606N-1000t-Global Technology |
NON SILICONE THERMAL GREASE 1KG |
 |
TG-S808-1000t-Global Technology |
SILICONE THERMAL GREASE 1KG |
 |
TC1-200GChip Quik, Inc. |
HEAT SINK COMPOUND - HIGH DENSIT |
 |
E150630CElba Lubes |
NON- SILICONE HEAT SINK COMPOUND |
 |
E250730CElba Lubes |
SILICONE HEAT SINK COMPOUND 2507 |
 |
8329-350GMG Chemicals |
EPOXY MOLD RELEASE (NON SILICONE |
 |
65-00-GEL37-0010Parker Chomerics |
THERM-A-GAP GEL 37 3.7 W/M-K DIS |
|
65-02-GEL37-0030Parker Chomerics |
THERM-A-GAP GEL 37 3.7 W/M-K DIS |
 |
340 CMPD 142G TUBEEllsworth Adhesives |
HEAT SINK COMPOUND WHT 142G TUBE |
 |
TG-NSP35LV-30CCt-Global Technology |
NON-SILICONE THERMAL PUTTY 30CC |
|
65-00-GEL75-0010Parker Chomerics |
THERM-A-GAP GEL 75 7.5 W/M-K DIS |
 |
21086Ellsworth Adhesives |
THERMAL ADHESIVE GRAY 25ML KIT |
|
65-02-GEL75-0030Parker Chomerics |
THERM-A-GAP GEL 75 7.5 W/M-K DIS |
|
65-00-GEL37-0180Parker Chomerics |
THERM-A-GAP GEL 37 3.7 W/M-K DIS |
|
2624519Henkel / Bergquist |
BERGQUIST LIQUIFORM TLF 6000HG 1 |
