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TC1-200G

TC1-200G

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Manufacturer Part
TC1-200G
Manufacturer
Chip Quik, Inc.
Description
HEAT SINK COMPOUND - HIGH DENSIT
Category
Fans, Thermal Management
Family
Thermal - Adhesives, Epoxies, Greases, Pastes
Series
-
InStock
2555
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:-
Package:Bulk
Part Status:Active
Type:Silicone Compound
Size / Dimension:200 gram Jar
Usable Temperature Range:-
Color:White
Thermal Conductivity:0.67W/m-K
Features:-
Shelf Life:60 Months
Storage/Refrigeration Temperature:37°F ~ 77°F (3°C ~ 25°C)

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