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| Type | Description |
|---|---|
| Series: | - |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 (Dual) |
| Attachment Method: | Clip and PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.000" (25.40mm) |
| Width: | 1.650" (41.91mm) |
| Diameter: | - |
| Fin Height: | 1.000" (25.40mm) |
| Power Dissipation @ Temperature Rise: | 12.0W @ 70°C |
| Thermal Resistance @ Forced Air Flow: | 4.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 5.70°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
 |
630-45ABT4EWakefield-Vette |
HEATSINK FOR BGAS FIN HGT .45" |
In Stock: 0 $1.42001 |
|
630-45ABT3Wakefield-Vette |
HEATSINK FOR 35MM BGA |
In Stock: 0 $1.42001 |
 |
PH3-76.2-25.4-0.21-1At-Global Technology |
PH3 76.2X25.4X0.21MM |
In Stock: 0 $1.41500 |
|
286-DBEWakefield-Vette |
HEATSINK TO-220 VERTICAL |
In Stock: 0 $1.43561 |
 |
HSE-B18508-0396HCUI Devices |
HEAT SINK, EXTRUSION, TO-218, 50 |
In Stock: 0 $1.43000 |
|
7038BGAavid |
BOARD LEVEL HEAT SINK |
In Stock: 0 $1.44562 |
|
624-45AB-T4EWakefield-Vette |
HEATSINK CPU 21MM SQ |
In Stock: 0 $1.44706 |
|
625-60ABT1EWakefield-Vette |
HEATSINK FOR 25MM BGA |
In Stock: 0 $1.44706 |
|
642-45ABT5Wakefield-Vette |
HEATSINK FOR 35MM BGA |
In Stock: 0 $1.44706 |
|
642-60ABT4EWakefield-Vette |
HEATSINK FOR 35MM BGA |
In Stock: 0 $1.44706 |
