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| Type | Description |
|---|---|
| Series: | PH3 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Heat Spreader |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Adhesive |
| Shape: | Rectangular |
| Length: | 3.000" (76.20mm) |
| Width: | 1.000" (25.40mm) |
| Diameter: | - |
| Fin Height: | 0.008" (0.21mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | - |
| Thermal Resistance @ Natural: | - |
| Material: | Copper |
| Material Finish: | Polyester |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
 |
286-DBEWakefield-Vette |
HEATSINK TO-220 VERTICAL |
In Stock: 0 $1.43561 |
 |
HSE-B18508-0396HCUI Devices |
HEAT SINK, EXTRUSION, TO-218, 50 |
In Stock: 0 $1.43000 |
|
7038BGAavid |
BOARD LEVEL HEAT SINK |
In Stock: 0 $1.44562 |
|
624-45AB-T4EWakefield-Vette |
HEATSINK CPU 21MM SQ |
In Stock: 0 $1.44706 |
|
625-60ABT1EWakefield-Vette |
HEATSINK FOR 25MM BGA |
In Stock: 0 $1.44706 |
|
642-45ABT5Wakefield-Vette |
HEATSINK FOR 35MM BGA |
In Stock: 0 $1.44706 |
|
642-60ABT4EWakefield-Vette |
HEATSINK FOR 35MM BGA |
In Stock: 0 $1.44706 |
|
TGH-0137-02t-Global Technology |
ALUMINIUM HEAT SINK 25.6X13.7MM |
In Stock: 0 $1.44123 |
|
624-35ABT4EWakefield-Vette |
HEATSINK FOR 21MM BGA |
In Stock: 0 $1.46058 |
|
624-35ABT5Wakefield-Vette |
HEATSINK FOR 21MM BGA |
In Stock: 0 $1.46058 |
