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| Type | Description |
|---|---|
| Series: | 630 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | - |
| Fin Height: | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 4.00°C/W @ 400 LFM |
| Thermal Resistance @ Natural: | - |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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PH3-76.2-25.4-0.21-1At-Global Technology |
PH3 76.2X25.4X0.21MM |
In Stock: 0 $1.41500 |
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286-DBEWakefield-Vette |
HEATSINK TO-220 VERTICAL |
In Stock: 0 $1.43561 |
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HSE-B18508-0396HCUI Devices |
HEAT SINK, EXTRUSION, TO-218, 50 |
In Stock: 0 $1.43000 |
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7038BGAavid |
BOARD LEVEL HEAT SINK |
In Stock: 0 $1.44562 |
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624-45AB-T4EWakefield-Vette |
HEATSINK CPU 21MM SQ |
In Stock: 0 $1.44706 |
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625-60ABT1EWakefield-Vette |
HEATSINK FOR 25MM BGA |
In Stock: 0 $1.44706 |
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642-45ABT5Wakefield-Vette |
HEATSINK FOR 35MM BGA |
In Stock: 0 $1.44706 |
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642-60ABT4EWakefield-Vette |
HEATSINK FOR 35MM BGA |
In Stock: 0 $1.44706 |
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TGH-0137-02t-Global Technology |
ALUMINIUM HEAT SINK 25.6X13.7MM |
In Stock: 0 $1.44123 |
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624-35ABT4EWakefield-Vette |
HEATSINK FOR 21MM BGA |
In Stock: 0 $1.46058 |
