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| Type | Description |
|---|---|
| Series: | 630 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | - |
| Fin Height: | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 4.00°C/W @ 400 LFM |
| Thermal Resistance @ Natural: | - |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
 |
HSE-B18635-035HCUI Devices |
HEAT SINK, EXTRUSION,TO-218, 63. |
In Stock: 0 $1.15780 |
 |
624-25ABT1EWakefield-Vette |
HEATSINK FOR 21MM BGA |
In Stock: 0 $1.17970 |
 |
CSM221-40AEOhmite |
HEATSINK BLACK ANODIZED |
In Stock: 0 $1.18800 |
 |
V2201N1-FASSMANN WSW Components |
HEATSINK CPU W/ADHESIVE STAMPED |
In Stock: 0 $1.19360 |
 |
TGH-0380-01t-Global Technology |
ALUMINIUM HEAT SINK 38X20MM |
In Stock: 0 $1.19392 |
|
628-35ABWakefield-Vette |
HEATSINK FOR 45MM BGA |
In Stock: 0 $1.21715 |
 |
HSE-B18381-0396HCUI Devices |
HEAT SINK, EXTRUSION, TO-218, 38 |
In Stock: 0 $1.22220 |
|
529801B02100GAavid |
BOARD LEVEL HEAT SINK |
In Stock: 0 $1.23584 |
|
630-60ABWakefield-Vette |
HEATSINK FOR BGA 35MM |
In Stock: 0 $1.23796 |
|
634-15ABWakefield-Vette |
HEATSINK SLIM VERT BLACK TO-220 |
In Stock: 0 $1.23796 |
