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| Type | Description |
|---|---|
| Series: | CSM |
| Package: | Box |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | Solderable Feet |
| Shape: | Rectangular, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 0.492" (12.50mm) |
| Diameter: | - |
| Fin Height: | 1.228" (31.20mm) |
| Power Dissipation @ Temperature Rise: | 6.0W @ 65°C |
| Thermal Resistance @ Forced Air Flow: | - |
| Thermal Resistance @ Natural: | 12.10°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
 |
V2201N1-FASSMANN WSW Components |
HEATSINK CPU W/ADHESIVE STAMPED |
In Stock: 0 $1.19360 |
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TGH-0380-01t-Global Technology |
ALUMINIUM HEAT SINK 38X20MM |
In Stock: 0 $1.19392 |
|
628-35ABWakefield-Vette |
HEATSINK FOR 45MM BGA |
In Stock: 0 $1.21715 |
 |
HSE-B18381-0396HCUI Devices |
HEAT SINK, EXTRUSION, TO-218, 38 |
In Stock: 0 $1.22220 |
|
529801B02100GAavid |
BOARD LEVEL HEAT SINK |
In Stock: 0 $1.23584 |
|
630-60ABWakefield-Vette |
HEATSINK FOR BGA 35MM |
In Stock: 0 $1.23796 |
|
634-15ABWakefield-Vette |
HEATSINK SLIM VERT BLACK TO-220 |
In Stock: 0 $1.23796 |
 |
V2200N1-F-LPASSMANN WSW Components |
HEATSINK CPU W/ADHESIVE STAMPED |
In Stock: 0 $1.22850 |
|
624-35ABT1EWakefield-Vette |
HEATSINK FOR 21MM BGA |
In Stock: 0 $1.26709 |
|
630-25ABT3Wakefield-Vette |
HEATSINK FOR 35MM BGA |
In Stock: 0 $1.28165 |
