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| Type | Description |
|---|---|
| Series: | 628 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.750" (44.45mm) |
| Width: | 1.700" (43.18mm) |
| Diameter: | - |
| Fin Height: | 0.350" (8.89mm) |
| Power Dissipation @ Temperature Rise: | 3.0W @ 50°C |
| Thermal Resistance @ Forced Air Flow: | 10.00°C/W @ 150 LFM |
| Thermal Resistance @ Natural: | - |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
 |
HSE-B18381-0396HCUI Devices |
HEAT SINK, EXTRUSION, TO-218, 38 |
In Stock: 0 $1.22220 |
 |
529801B02100GAavid |
BOARD LEVEL HEAT SINK |
In Stock: 0 $1.23584 |
|
630-60ABWakefield-Vette |
HEATSINK FOR BGA 35MM |
In Stock: 0 $1.23796 |
|
634-15ABWakefield-Vette |
HEATSINK SLIM VERT BLACK TO-220 |
In Stock: 0 $1.23796 |
 |
V2200N1-F-LPASSMANN WSW Components |
HEATSINK CPU W/ADHESIVE STAMPED |
In Stock: 0 $1.22850 |
|
624-35ABT1EWakefield-Vette |
HEATSINK FOR 21MM BGA |
In Stock: 0 $1.26709 |
|
630-25ABT3Wakefield-Vette |
HEATSINK FOR 35MM BGA |
In Stock: 0 $1.28165 |
|
630-25ABT4EWakefield-Vette |
HEATSINK FOR 35MM BGA |
In Stock: 0 $1.28165 |
|
513101B02500GAavid |
BOARD LEVEL HEAT SINK |
In Stock: 0 $1.28169 |
|
579704B00000GAavid |
BOARD LEVEL HEAT SINK |
In Stock: 0 $1.28305 |
