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| Type | Description |
|---|---|
| Series: | CSM |
| Package: | Box |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | Solderable Feet |
| Shape: | Rectangular, Fins |
| Length: | 1.173" (29.80mm) |
| Width: | 0.562" (14.27mm) |
| Diameter: | - |
| Fin Height: | 1.228" (31.20mm) |
| Power Dissipation @ Temperature Rise: | 5.0W @ 60°C |
| Thermal Resistance @ Forced Air Flow: | - |
| Thermal Resistance @ Natural: | 11.30°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
 |
HSE-B18508-035HCUI Devices |
HEAT SINK, EXTRUSION, TO-218, 50 |
In Stock: 0 $1.02200 |
 |
628-20ABWakefield-Vette |
HEATSINK FOR 45MM BGA |
In Stock: 0 $1.03405 |
|
593202B03400GAavid |
BOARD LEVEL HEAT SINK |
In Stock: 0 $1.03406 |
 |
XL25-40-40-5-T1-0.25t-Global Technology |
CERAMIC HEAT SPREADER 40X40MM GR |
In Stock: 92 $1.03000 |
|
624-60ABWakefield-Vette |
HEATSINK FOR 21MM BGA |
In Stock: 0 $1.04862 |
 |
CSM221-28AEOhmite |
HEATSINK BLACK ANODIZED |
In Stock: 0 $1.03950 |
|
532602B00000Aavid |
BOARD LEVEL HEAT SINK |
In Stock: 0 $1.05909 |
 |
HSE-B18508-060H-WCUI Devices |
HEAT SINK, EXTRUSION,TO-218, 50. |
In Stock: 0 $1.05840 |
 |
HSE-B18318-0396HCUI Devices |
HEAT SINK, EXTRUSION,TO-218, 31. |
In Stock: 0 $1.05840 |
 |
HSE-B18508-035H-03CUI Devices |
HEAT SINK, EXTRUSION, TO-218, 50 |
In Stock: 0 $1.07100 |
