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| Type | Description |
|---|---|
| Series: | HSE |
| Package: | Box |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-218 |
| Attachment Method: | PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.250" (31.75mm) |
| Width: | 1.654" (42.00mm) |
| Diameter: | - |
| Fin Height: | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | 9.1W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 2.57°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 8.24°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
 |
HSE-B18508-035H-03CUI Devices |
HEAT SINK, EXTRUSION, TO-218, 50 |
In Stock: 0 $1.07100 |
 |
628-25ABWakefield-Vette |
HEATSINK FOR 45MM BGA |
In Stock: 0 $1.09232 |
|
642-60ABWakefield-Vette |
HEATSINK FOR 35MM BGA |
In Stock: 0 $1.09232 |
|
529901B00000Aavid |
BOARD LEVEL HEAT SINK |
In Stock: 0 $1.09868 |
|
581101B02500GAavid |
HEAT SINK |
In Stock: 0 $1.11141 |
 |
V2136N1-F-LPASSMANN WSW Components |
HEATSINK CPU W/ADHESIVE STAMPED |
In Stock: 0 $1.10550 |
 |
XL25-40-40-2.0t-Global Technology |
XL25 CERAMIC BOARD 40X40X2MM |
In Stock: 16 $1.11000 |
 |
TG-CJP-12-LI98t-Global Technology |
CERAMIC HEATSINK |
In Stock: 0 $1.11000 |
|
625-60ABWakefield-Vette |
HEATSINK FOR 25MM BGA |
In Stock: 0 $1.13601 |
 |
HSE-B630-04HCUI Devices |
HEAT SINK, EXTRUSION, TO-220, 63 |
In Stock: 0 $1.13400 |
