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| Type | Description |
|---|---|
| Series: | - |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | - |
| Fin Height: | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | - |
| Thermal Resistance @ Natural: | - |
| Material: | Aluminum Alloy |
| Material Finish: | Natural Anodized |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
 |
XL25-40-40-2.0t-Global Technology |
XL25 CERAMIC BOARD 40X40X2MM |
In Stock: 16 $1.11000 |
 |
TG-CJP-12-LI98t-Global Technology |
CERAMIC HEATSINK |
In Stock: 0 $1.11000 |
 |
625-60ABWakefield-Vette |
HEATSINK FOR 25MM BGA |
In Stock: 0 $1.13601 |
 |
HSE-B630-04HCUI Devices |
HEAT SINK, EXTRUSION, TO-220, 63 |
In Stock: 0 $1.13400 |
|
634-10ABWakefield-Vette |
HEATSINK TO-220 VERT MT BLK 1" |
In Stock: 0 $1.15057 |
|
690-3BWakefield-Vette |
HEATSINK EXTRUSION |
In Stock: 0 $1.15057 |
 |
HSE-B18635-035H-04CUI Devices |
HEAT SINK, EXTRUSION, TO-218, 63 |
In Stock: 0 $1.14660 |
|
630-45ABWakefield-Vette |
HEATSINK FOR BGAS FIN HGT .45" |
In Stock: 0 $1.16513 |
 |
HSE-B18635-035HCUI Devices |
HEAT SINK, EXTRUSION,TO-218, 63. |
In Stock: 0 $1.15780 |
 |
624-25ABT1EWakefield-Vette |
HEATSINK FOR 21MM BGA |
In Stock: 0 $1.17970 |
