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| Type | Description |
|---|---|
| Series: | 628 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.750" (44.45mm) |
| Width: | 1.700" (43.18mm) |
| Diameter: | - |
| Fin Height: | 0.200" (5.08mm) |
| Power Dissipation @ Temperature Rise: | 4.0W @ 80°C |
| Thermal Resistance @ Forced Air Flow: | 8.00°C/W @ 300 LFM |
| Thermal Resistance @ Natural: | - |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
 |
593202B03400GAavid |
BOARD LEVEL HEAT SINK |
In Stock: 0 $1.03406 |
 |
XL25-40-40-5-T1-0.25t-Global Technology |
CERAMIC HEAT SPREADER 40X40MM GR |
In Stock: 92 $1.03000 |
|
624-60ABWakefield-Vette |
HEATSINK FOR 21MM BGA |
In Stock: 0 $1.04862 |
 |
CSM221-28AEOhmite |
HEATSINK BLACK ANODIZED |
In Stock: 0 $1.03950 |
|
532602B00000Aavid |
BOARD LEVEL HEAT SINK |
In Stock: 0 $1.05909 |
 |
HSE-B18508-060H-WCUI Devices |
HEAT SINK, EXTRUSION,TO-218, 50. |
In Stock: 0 $1.05840 |
 |
HSE-B18318-0396HCUI Devices |
HEAT SINK, EXTRUSION,TO-218, 31. |
In Stock: 0 $1.05840 |
 |
HSE-B18508-035H-03CUI Devices |
HEAT SINK, EXTRUSION, TO-218, 50 |
In Stock: 0 $1.07100 |
|
628-25ABWakefield-Vette |
HEATSINK FOR 45MM BGA |
In Stock: 0 $1.09232 |
|
642-60ABWakefield-Vette |
HEATSINK FOR 35MM BGA |
In Stock: 0 $1.09232 |
