| Type | Description |
|---|---|
| Series: | 110 |
| Package: | Tube |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 24 (2 x 12) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | Flash |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
16-3518-10TAries Electronics, Inc. |
CONN IC DIP SOCKET 16POS GOLD |
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ICM-324-1-GT-HTAdam Tech |
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D2899-42Harwin |
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114-87-628-41-117101Preci-Dip |
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PLCC-52-ATAdam Tech |
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24-6518-10Aries Electronics, Inc. |
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16-3513-10Aries Electronics, Inc. |
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