| Type | Description |
|---|---|
| Series: | 518 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 16 (2 x 8) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | - |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
ICM-324-1-GT-HTAdam Tech |
MACHINE PIN SOCKET, IC, DIP, 24P |
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ICF-308-T-OSamtec, Inc. |
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BU14OZ-178-HTOn-Shore Technology, Inc. |
CONN IC DIP SOCKET 14POS GOLD |
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CONN IC DIP SOCKET 3POS GOLD |
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114-87-628-41-117101Preci-Dip |
CONN IC DIP SOCKET 28POS GOLD |
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PLCC-52-ATAdam Tech |
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24-6518-10Aries Electronics, Inc. |
CONN IC DIP SOCKET 24POS GOLD |
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16-3513-10Aries Electronics, Inc. |
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