Type | Description |
---|---|
Series: | XR2 |
Package: | Bulk |
Part Status: | Active |
Type: | SIP |
Number of Positions or Pins (Grid): | 32 (1 x 32) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
Contact Material - Post: | Beryllium Copper |
Housing Material: | Polybutylene Terephthalate (PBT), Glass Filled |
Operating Temperature: | -55°C ~ 125°C |
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299-93-320-11-001000Mill-Max |
CONN IC DIP SOCKET 20POS GOLD |
In Stock: 57 $7.06000 |
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116-43-210-41-006000Mill-Max |
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110-93-640-41-801000Mill-Max |
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In Stock: 35 $10.07000 |
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317-43-116-41-005000Mill-Max |
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In Stock: 44 $10.33000 |
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299-93-628-10-002000Mill-Max |
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1554653-1TE Connectivity AMP Connectors |
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242-1293-00-0602J3M |
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228-7474-55-19023M |
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