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| Type | Description |
|---|---|
| Series: | - |
| Package: | Tray |
| Part Status: | Active |
| Type: | LGA |
| Number of Positions or Pins (Grid): | 3647 |
| Pitch - Mating: | - |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Copper Alloy |
| Mounting Type: | Surface Mount |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | - |
| Contact Finish - Post: | - |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Copper Alloy |
| Housing Material: | Thermoplastic |
| Operating Temperature: | - |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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228-7474-55-19023M |
CONN SOCKET SOIC 28POS GOLD |
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2-2822979-4TE Connectivity AMP Connectors |
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NTE435P18NTE Electronics, Inc. |
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IC 20 PIN DUAL INLINE |
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NTE423NTE Electronics, Inc. |
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