Type | Description |
---|---|
Series: | 917 |
Package: | Tube |
Part Status: | Active |
Type: | Transistor, TO-100 |
Number of Positions or Pins (Grid): | 10 (Round) |
Pitch - Mating: | - |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | - |
Contact Finish - Post: | Tin-Lead |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Material - Post: | Brass Alloy |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Operating Temperature: | -55°C ~ 125°C |
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115-43-324-41-003000Mill-Max |
CONN IC DIP SOCKET 24POS GOLD |
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614-43-314-31-012000Mill-Max |
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115-43-324-41-001000Mill-Max |
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111-93-624-41-001000Mill-Max |
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14-6511-10Aries Electronics, Inc. |
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110-13-316-41-801000Mill-Max |
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