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| Type | Description |
|---|---|
| Series: | XR2 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 18 (2 x 9) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polybutylene Terephthalate (PBT), Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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115-93-628-41-003000Mill-Max |
CONN IC DIP SOCKET 28POS GOLD |
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822-AG11D-ESL-LFTE Connectivity AMP Connectors |
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24-4518-10Aries Electronics, Inc. |
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In Stock: 106 $2.98000 |
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111-93-628-41-001000Mill-Max |
CONN IC DIP SOCKET 28POS GOLD |
In Stock: 263 $3.17000 |
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111-43-628-41-001000Mill-Max |
CONN IC DIP SOCKET 28POS GOLD |
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123-43-316-41-001000Mill-Max |
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520-AG11D-ESTE Connectivity AMP Connectors |
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XR2A-0802Omron Electronics Components |
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In Stock: 173 $3.27000 |
