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| Type | Description |
|---|---|
| Series: | BU-178HT |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 20 (2 x 10) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 78.7µin (2.00µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Surface Mount |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Copper |
| Contact Finish Thickness - Post: | Flash |
| Contact Material - Post: | Brass |
| Housing Material: | Polybutylene Terephthalate (PBT), Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
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