| Image | Part Number | Description |
|---|---|---|
 |
LCM CABLEiBASE Technology |
AC, IIO2 LCM MODULE CABLE (C501E |
|
USB-74BiBASE Technology |
AC, INTERNAL USB 2.0 CABLE, 2-PO |
|
IB881R-PWiBASE Technology |
FC, ATX POWER BOARD FOR IB881 SE |
|
IB881R-SWiBASE Technology |
FC, ATX POWER SWITCH BOARD FOR I |
 |
FWA8208-HDiBASE Technology |
AC, 2.5" DUAL HDD-BRT-KIT + CABL |
|
ID108iBASE Technology |
FC, 6W AMPLIFIER BOARD, 12V DC-I |
|
IP117iBASE Technology |
FC, PCIE(16X) X 1 RISER CARD, NO |
|
HEATSINK CPU BGA1310iBASE Technology |
AC, CPU HEATSINK BGA1310 FOR MBN |
|
ID106iBASE Technology |
FC, 3.1W AMPLIFIER BOARD, 12V DC |
|
RG1100iBASE Technology |
AC, COOLER HEATSINK FOR INTEL SO |
|
ID724iBASE Technology |
LVDS/DVI EXTENSION CARD |
|
H052LGA1155001000PiBASE Technology |
AC, COOLER HEATSINK FOR INTEL SO |
|
HEATSINK CPU LGA1156iBASE Technology |
AC, CPU HEATSINK LAG1156 FOR MB9 |
|
IP430iBASE Technology |
FC, PCIE(16E) TO PCIE(8X) X 1 SL |
|
ECC-01008-02-GPiBASE Technology |
AC, COOLER HEATSINK FOR INTEL RP |
|
IIO2iBASE Technology |
AC, 16X2 LCM MODULE WITH 4 BUTTO |
|
H052SK1156ECCS000PiBASE Technology |
AC, COOLER HEATSINK FOR INTEL SO |
|
ID386iBASE Technology |
FC, XILINX XC3S200AN FPGA THRU L |
|
ID460iBASE Technology |
AC, DC CONVERTER, INPUT +19V, OU |
|
IIOiBASE Technology |
AC, 16X2 LCM MODULE WITH 5 BUTTO |
