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| Type | Description |
|---|---|
| Series: | XL-25 |
| Package: | Box |
| Part Status: | Obsolete |
| Type: | Heat Spreader |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square |
| Length: | 0.394" (10.00mm) |
| Width: | 0.394" (10.00mm) |
| Diameter: | - |
| Fin Height: | 0.085" (2.15mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | - |
| Thermal Resistance @ Natural: | - |
| Material: | Ceramic |
| Material Finish: | - |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
 |
XLI98-10-10-2.25t-Global Technology |
XL25 CERAMIC 10X10MM W/LI98C ADH |
In Stock: 0 $0.41000 |
 |
XLI98-20-20-2.25t-Global Technology |
XL25 CERAMIC 20X20MM W/LI98C ADH |
In Stock: 0 $0.64000 |
 |
DA-T263-201EOhmite |
TO-263 SMD HEAT SINK ANODZD |
In Stock: 0 $0.00000 |
 |
DA-T268-301EOhmite |
TO-268 SMD HEAT SINK ANODZD |
In Stock: 0 $0.00000 |
 |
DV-T263-201EOhmite |
TO-263 SMD HEAT SINK |
In Stock: 0 $0.00000 |
|
DV-T268-301EOhmite |
TO-268 SMD HEAT SINK |
In Stock: 0 $0.00000 |
|
0372501020Woodhead - Molex |
CHIP-SET COOLER #1 ALUMINUM 6500 |
In Stock: 0 $0.00000 |
|
0372503020Woodhead - Molex |
CHIP-SET COOLER #3 ALUMINUM 6500 |
In Stock: 0 $0.00000 |
|
RUR6712UCTS Corporation |
HEATSINK PRESSON PANEL MNT TO-92 |
In Stock: 0 $0.00000 |
 |
FEX35-35-21/T710/M2CTS Corporation |
FAN AXIAL 34.6X19.8MM 5VDC 2510 |
In Stock: 0 $0.00000 |
