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| Type | Description |
|---|---|
| Series: | 625 |
| Package: | - |
| Part Status: | Obsolete |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | - |
| Fin Height: | 0.250" (6.35mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 12.00°C/W @ 500 LFM |
| Thermal Resistance @ Natural: | - |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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|---|---|---|---|
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658-25ABT1Wakefield-Vette |
HEATSINK CPU 28MM SQ BLK W/TAPE |
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658-25ABT4Wakefield-Vette |
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658-45ABT2Wakefield-Vette |
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658-45ABT4Wakefield-Vette |
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658-60ABT1Wakefield-Vette |
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