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| Type | Description |
|---|---|
| Series: | FHS |
| Package: | Box |
| Part Status: | Active |
| Type: | Board Level |
| Package Cooled: | Intel LGA1155 CPU Cooler |
| Attachment Method: | Bolt On |
| Shape: | Rectangular |
| Length: | 7.843" (199.21mm) |
| Width: | 3.481" (88.42mm) |
| Diameter: | - |
| Fin Height: | 1.035" (26.30mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | - |
| Thermal Resistance @ Natural: | 0.37°C/W |
| Material: | Aluminum, Copper, Plastic |
| Material Finish: | - |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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512-3MWakefield-Vette |
HEATSINK FOR PWR MOD/IGBT/RELAY |
In Stock: 0 $38.54320 |
|
109X9112PT0H016Sanyo Denki |
P4,775-LAND LGA |
In Stock: 0 $38.26375 |
|
40519Vicor |
BOM ASSY 4623 DUAL HTSNK 11MM |
In Stock: 0 $38.28000 |
|
3-1542006-3TE Connectivity AMP Connectors |
V-2461 = 47.5MM HS ASSY ALUM C |
In Stock: 0 $38.34792 |
|
TX1806BCTS Corporation |
THERMAL LINK PRESS ON BLK TO-18 |
In Stock: 0 $38.93400 |
|
109X9912T0S016Sanyo Denki |
P4,CELERON,1.7-3.4GHZ,FC-PGA2 |
In Stock: 0 $38.98000 |
|
TX05062BCTS Corporation |
THERMAL LINK PRESS ON BLK TO-5 |
In Stock: 0 $40.28400 |
|
132-4.5BWakefield-Vette |
HEATSINK EXTRUDED |
In Stock: 0 $42.10080 |
|
PH3-222-165-0.21-1At-Global Technology |
PH3 222X165X0.21MM W/ADH |
In Stock: 0 $43.32000 |
|
132-5B9Wakefield-Vette |
HEATSINK EXTRUDED |
In Stock: 0 $43.47400 |
