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| Type | Description |
|---|---|
| Series: | XL-25 |
| Package: | Tray |
| Part Status: | Obsolete |
| Type: | Heat Spreader |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | - |
| Shape: | Square |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | - |
| Fin Height: | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | - |
| Thermal Resistance @ Natural: | - |
| Material: | Ceramic |
| Material Finish: | - |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
 |
XL25-40-40-5t-Global Technology |
CERAMIC HEAT SPREADER 40X40MM GR |
In Stock: 99 $0.71000 |
 |
268-85CTEWakefield-Vette |
HEATSINK |
In Stock: 0 $0.72821 |
 |
HSE-B254-04HCUI Devices |
HEAT SINK, EXTRUSION, TO-220/TO- |
In Stock: 11 $0.73000 |
 |
HSE-B20508-035H-WCUI Devices |
HEAT SINK, EXTRUSION, TO-220, 50 |
In Stock: 0 $0.73220 |
 |
HSE-B381-045HCUI Devices |
HEAT SINK, EXTRUSION, TO-220, 38 |
In Stock: 0 $0.73500 |
|
288-1ABEWakefield-Vette |
HEATSINK FOR TO220 |
In Stock: 0 $0.74434 |
|
508600B00000GAavid |
BOARD LEVEL HEAT SINK |
In Stock: 0 $0.74993 |
 |
HSE-B18254-060H-WCUI Devices |
HEAT SINK, EXTRUSION, TO-218, 25 |
In Stock: 0 $0.74340 |
 |
V2199N1-FASSMANN WSW Components |
HEATSINK CPU W/ADHESIVE STAMPED |
In Stock: 0 $0.74480 |
 |
HSE-B20630-040HCUI Devices |
HEAT SINK, EXTRUSION, TO-220, 63 |
In Stock: 0 $0.75600 |
