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| Type | Description |
|---|---|
| Series: | - |
| Package: | Bag |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | TO-5 |
| Attachment Method: | Press Fit |
| Shape: | Rectangular, Fins |
| Length: | 0.500" (12.70mm) |
| Width: | 0.830" (21.08mm) |
| Diameter: | 0.316" (8.03mm) ID |
| Fin Height: | 0.395" (10.03mm) |
| Power Dissipation @ Temperature Rise: | 1.4W @ 50°C |
| Thermal Resistance @ Forced Air Flow: | 30.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 38.00°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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578405B00000GAavid |
BOARD LEVEL HEAT SINK |
In Stock: 0 $0.67221 |
|
560200B00000GAavid |
BOARD LEVEL HEAT SINK |
In Stock: 0 $0.67478 |
|
579604B00000GAavid |
BOARD LEVEL HEAT SINK |
In Stock: 0 $0.67448 |
|
7021BGAavid |
BOARD LEVEL HEAT SINK |
In Stock: 0 $0.68637 |
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HSE-B20500-040HCUI Devices |
HEAT SINK, EXTRUSION, TO-220, 50 |
In Stock: 0 $0.68005 |
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HSE-B20500-040H-01CUI Devices |
HEAT SINK, EXTRUSION, TO-220, 50 |
In Stock: 0 $0.68005 |
|
650-BWakefield-Vette |
HEATSINK FOR DIPS |
In Stock: 0 $0.69908 |
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PH3N-76.2-25.4-0.062-1At-Global Technology |
PH3N NANO 76.2X25.4X0.062MM |
In Stock: 0 $0.70500 |
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HSS-B20-0508H-01CUI Devices |
HEATSINK TO-220 7.4W ALUMINUM |
In Stock: 0 $0.70420 |
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HSE-B20508-035HCUI Devices |
HEAT SINK, EXTRUSION, TO-220, 50 |
In Stock: 0 $0.70420 |
