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| Type | Description |
|---|---|
| Series: | HSE |
| Package: | Box |
| Part Status: | Active |
| Type: | Board Level, Vertical |
| Package Cooled: | TO-220 |
| Attachment Method: | PC Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.500" (38.10mm) |
| Width: | 1.375" (34.93mm) |
| Diameter: | - |
| Fin Height: | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | 6.5W @ 75°C |
| Thermal Resistance @ Forced Air Flow: | 3.66°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | 11.54°C/W |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
 |
HSE-B20381-035H-02CUI Devices |
HEAT SINK, EXTRUSION, TO-220, 38 |
In Stock: 0 $0.60175 |
 |
V7477Y2ASSMANN WSW Components |
HEATSINK ALUM ANOD |
In Stock: 0 $0.60465 |
 |
HSS-C2591-SMT-TRCUI Devices |
HEAT SINK TO-263 COPPER |
In Stock: 0 $0.60480 |
 |
HSE-B20381-035H-01CUI Devices |
HEAT SINK, EXTRUSION, TO-220, 38 |
In Stock: 0 $0.61335 |
 |
HSE-B381-04HCUI Devices |
HEAT SINK, EXTRUSION, TO-220/TO- |
In Stock: 0 $0.62640 |
 |
V2198N1-FASSMANN WSW Components |
HEATSINK CPU W/ADHESIVE STAMPED |
In Stock: 0 $0.62720 |
 |
HSE-B20254-056HCUI Devices |
HEAT SINK, EXTRUSION, TO-220, 25 |
In Stock: 0 $0.62930 |
 |
234-75ABWakefield-Vette |
HEATSINK LOW PROFILE |
In Stock: 0 $0.64082 |
|
5022NGAavid |
HEATSINK |
In Stock: 0 $0.64292 |
 |
XL25-30-30-5t-Global Technology |
CERAMIC HEAT SPREADER 30X30MM GR |
In Stock: 90 $0.64000 |
