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| Type | Description |
|---|---|
| Series: | BDN |
| Package: | Box |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins |
| Length: | 1.310" (33.27mm) |
| Width: | 1.310" (33.27mm) |
| Diameter: | - |
| Fin Height: | 0.355" (9.02mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 6.00°C/W @ 400 LFM |
| Thermal Resistance @ Natural: | 16.10°C/W |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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