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| Type | Description |
|---|---|
| Series: | pushPIN™ |
| Package: | Bulk |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | - |
| Fin Height: | 0.900" (22.86mm) |
| Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 7.31°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | - |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
 |
ATS-H1-103-C2-R1Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X9.5MM XCUT T766 |
In Stock: 0 $10.89000 |
 |
ATS-P2-38-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 36.83X57.6X22.86MM T766 |
In Stock: 0 $10.89000 |
 |
ATS-50170G-C1-R0Advanced Thermal Solutions, Inc. |
HEAT SINK 17MM X 17MM X 12.5MM |
In Stock: 0 $10.89000 |
 |
ATS-53270K-C1-R0Advanced Thermal Solutions, Inc. |
HEAT SINK 27MM X 27MM X 14.5MM |
In Stock: 0 $10.89000 |
 |
ATS-50250B-C3-R0Advanced Thermal Solutions, Inc. |
HEAT SINK PASSIVE BGA SPREAD CLP |
In Stock: 0 $10.91000 |
 |
ATS-P2-39-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 57.9X60.96X5.84MM T766 |
In Stock: 0 $10.91000 |
 |
ATS-53190R-C1-R0Advanced Thermal Solutions, Inc. |
HEAT SINK 19MM X 19MM X 19.5MM |
In Stock: 0 $10.91000 |
 |
ATS-50375B-C1-R0Advanced Thermal Solutions, Inc. |
HEAT SINK 37.5 X 37.5 X 7.5MM |
In Stock: 0 $10.92000 |
 |
ATS-P1-26-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 70X70X10MM XCUT T766 |
In Stock: 0 $10.96000 |
 |
ATS-60003-C0-R0Advanced Thermal Solutions, Inc. |
HEAT SINK 61MMX58.2MMX7MM |
In Stock: 30 $10.96000 |
