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QFS-016-04.25-H-D-DP-A-P

QFS-016-04.25-H-D-DP-A-P

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Manufacturer Part
QFS-016-04.25-H-D-DP-A-P
Manufacturer
Samtec, Inc.
Description
CONN DIFF ARRAY RCP 32P SMD GOLD
Category
Connectors, Interconnects
Family
Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
Series
-
InStock
8098
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:Power Q2™ QFS
Package:Tray
Part Status:Active
Connector Type:Differential Pair Array, Female
Number of Positions:32
Pitch:0.025" (0.64mm)
Number of Rows:2
Mounting Type:Surface Mount
Features:Board Guide, Ground Bus (Plane), Pick and Place
Contact Finish:Gold
Contact Finish Thickness:30.0µin (0.76µm)
Mated Stacking Heights:10mm, 11mm, 14mm
Height Above Board:0.278" (7.06mm)

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