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HIC-764-SST

HIC-764-SST

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Manufacturer Part
HIC-764-SST
Manufacturer
Samtec, Inc.
Description
CONN IC DIP SOCKET 64POS GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
4218
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:HIC
Package:Tube
Part Status:Active
Type:DIP, 0.75" (19.05mm) Row Spacing
Number of Positions or Pins (Grid):64 (2 x 32)
Pitch - Mating:0.070" (1.78mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.070" (1.78mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass
Housing Material:Polyester, Glass Filled
Operating Temperature:-

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