Type | Description |
---|---|
Series: | 55 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 28 (2 x 14) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Nickel Boron |
Contact Finish Thickness - Mating: | 50.0µin (1.27µm) |
Contact Material - Mating: | Beryllium Nickel |
Mounting Type: | Through Hole |
Features: | Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Nickel Boron |
Contact Finish Thickness - Post: | 50.0µin (1.27µm) |
Contact Material - Post: | Beryllium Nickel |
Housing Material: | Polyetheretherketone (PEEK), Glass Filled |
Operating Temperature: | -55°C ~ 250°C |
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28-6551-18Aries Electronics, Inc. |
CONN IC DIP SOCKET ZIF 28POS |
In Stock: 0 $84.93222 |
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28-6552-18Aries Electronics, Inc. |
CONN IC DIP SOCKET ZIF 28POS |
In Stock: 0 $84.93222 |
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28-6553-18Aries Electronics, Inc. |
CONN IC DIP SOCKET ZIF 32POS TIN |
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28-3554-18Aries Electronics, Inc. |
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522-13-273-21-125001Mill-Max |
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In Stock: 0 $85.75020 |
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522-13-273-21-125002Mill-Max |
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522-13-273-21-125003Mill-Max |
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In Stock: 0 $85.75020 |
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192-PRS17027-12Aries Electronics, Inc. |
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522-93-361-19-000001Mill-Max |
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In Stock: 0 $86.37220 |