| Type | Description |
|---|---|
| Series: | 550 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | BGA |
| Number of Positions or Pins (Grid): | 520 (31 x 31) |
| Pitch - Mating: | 0.050" (1.27mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Brass |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.050" (1.27mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | FR4 Epoxy Glass |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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511-13-238-19-086001Mill-Max |
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511-13-238-19-086002Mill-Max |
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511-13-238-19-086003Mill-Max |
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In Stock: 0 $47.87900 |
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551-10-256-16-000004Mill-Max |
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551-10-256-19-081004Mill-Max |
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In Stock: 0 $47.93560 |
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48-3574-16Aries Electronics, Inc. |
CONN IC DIP SOCKET ZIF 48POS TIN |
In Stock: 0 $47.94000 |
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48-6574-16Aries Electronics, Inc. |
CONN IC DIP SOCKET ZIF 48POS GLD |
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48-3570-16Aries Electronics, Inc. |
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48-3571-16Aries Electronics, Inc. |
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48-3572-16Aries Electronics, Inc. |
CONN IC DIP SOCKET ZIF 48POS |
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