| Type | Description |
|---|---|
| Series: | PGM |
| Package: | Bulk |
| Part Status: | Active |
| Type: | PGA |
| Number of Positions or Pins (Grid): | - |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | - |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -55°C ~ 105°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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558-10-272M20-001104Preci-Dip |
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510-13-076-11-041002Mill-Max |
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517-83-565-21-111111Preci-Dip |
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24-3573-16Aries Electronics, Inc. |
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24-6570-16Aries Electronics, Inc. |
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24-6571-16Aries Electronics, Inc. |
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In Stock: 0 $28.13909 |
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24-6573-16Aries Electronics, Inc. |
CONN IC DIP SOCKET ZIF 24POS |
In Stock: 0 $28.13909 |
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24-3574-16Aries Electronics, Inc. |
CONN IC DIP SOCKET ZIF 24POS TIN |
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