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| Type | Description |
|---|---|
| Series: | PGM |
| Package: | Bulk |
| Part Status: | Active |
| Type: | PGA |
| Number of Positions or Pins (Grid): | - |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | - |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
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44-6553-11Aries Electronics, Inc. |
CONN IC DIP SOCKET ZIF 44POS GLD |
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44-6554-11Aries Electronics, Inc. |
CONN IC DIP SOCKET ZIF 44POS GLD |
In Stock: 0 $24.66000 |
