| Type | Description |
|---|---|
| Series: | 514 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | BGA |
| Number of Positions or Pins (Grid): | 272 (20 x 20) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | Flash |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Surface Mount |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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30-1508-21Aries Electronics, Inc. |
CONN IC DIP SOCKET 30POS GOLD |
In Stock: 0 $19.84500 |
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30-1508-31Aries Electronics, Inc. |
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48-6823-90TAries Electronics, Inc. |
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515-91-209-17-081001Mill-Max |
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515-91-209-17-081002Mill-Max |
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515-91-209-17-081003Mill-Max |
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110-41-428-61-001000Mill-Max |
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In Stock: 0 $19.85857 |
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110-91-328-61-001000Mill-Max |
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In Stock: 0 $19.85857 |
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110-91-428-61-001000Mill-Max |
CONN IC SKT DBL |
In Stock: 0 $19.85857 |