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| Type | Description |
|---|---|
| Series: | 612 |
| Package: | Tube |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 52 (2 x 26) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Carrier, Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin-Lead |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass Alloy |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature: | -55°C ~ 125°C |
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|---|---|---|---|
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116-43-950-41-008000Mill-Max |
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32-6551-11Aries Electronics, Inc. |
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32-6552-11Aries Electronics, Inc. |
CONN IC DIP SOCKET ZIF 32POS GLD |
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32-3554-11Aries Electronics, Inc. |
CONN IC DIP SOCKET ZIF 32POS GLD |
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122-13-328-41-801000Mill-Max |
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