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| Type | Description |
|---|---|
| Series: | 514 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | BGA |
| Number of Positions or Pins (Grid): | 192 (16 x 16) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Surface Mount |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
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|---|---|---|---|
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517-87-503-22-131111Preci-Dip |
CONN SOCKET PGA 503POS GOLD |
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24-C182-30Aries Electronics, Inc. |
CONN IC DIP SOCKET 24POS GOLD |
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24-C212-20Aries Electronics, Inc. |
CONN IC DIP SOCKET 24POS GOLD |
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24-C212-30Aries Electronics, Inc. |
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24-C300-20Aries Electronics, Inc. |
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24-C300-30Aries Electronics, Inc. |
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612-11-640-41-001000Mill-Max |
SKT CARRIER SOLDRTL |
In Stock: 0 $17.16000 |
