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| Type | Description |
|---|---|
| Series: | APA |
| Package: | Bulk |
| Part Status: | Active |
| Type: | - |
| Number of Positions or Pins (Grid): | 40 (2 x 20) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 20.0µin (0.51µm) |
| Contact Material - Mating: | Phosphor Bronze |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 20.0µin (0.51µm) |
| Contact Material - Post: | Phosphor Bronze |
| Housing Material: | Polybutylene Terephthalate (PBT), Glass Filled |
| Operating Temperature: | - |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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115-47-650-41-003000Mill-Max |
STANDRD SOLDRTL DBL SKT |
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121-11-316-41-001000Mill-Max |
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20-0511-11Aries Electronics, Inc. |
CONN SOCKET SIP 20POS GOLD |
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30-9513-11HAries Electronics, Inc. |
CONN IC DIP SOCKET 30POS GOLD |
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8058-24G1TE Connectivity AMP Connectors |
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124-41-314-41-002000Mill-Max |
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124-91-314-41-002000Mill-Max |
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614-41-322-41-001000Mill-Max |
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614-41-422-41-001000Mill-Max |
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