Type | Description |
---|---|
Series: | 714 |
Package: | Bulk |
Part Status: | Active |
Type: | SIP |
Number of Positions or Pins (Grid): | 59 (1 x 59) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Carrier |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
Contact Material - Post: | Brass Alloy |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Operating Temperature: | -55°C ~ 125°C |
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116-47-324-41-007000Mill-Max |
STANDRD SOLDRTL DBL SKT |
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116-47-624-41-007000Mill-Max |
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111-47-650-41-001000Mill-Max |
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123-41-318-41-001000Mill-Max |
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In Stock: 0 $13.69515 |
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104-13-314-41-780000Mill-Max |
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In Stock: 0 $13.69863 |
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614-43-210-31-012000Mill-Max |
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In Stock: 0 $13.69863 |
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36-3513-11HAries Electronics, Inc. |
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In Stock: 0 $13.70000 |