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| Type | Description |
|---|---|
| Series: | 123 |
| Package: | Tube |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 20 (2 x 10) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | Flash |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass Alloy |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature: | -55°C ~ 125°C |
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|---|---|---|---|
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110-44-650-41-001000Mill-Max |
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110-93-318-41-605000Mill-Max |
CONN IC DIP SOCKET 18POS GOLD |
In Stock: 0 $13.37394 |
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110-43-318-41-605000Mill-Max |
CONN IC SKT DBL |
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116-41-316-41-006000Mill-Max |
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116-91-316-41-006000Mill-Max |
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3883-312-10-32Aries Electronics, Inc. |
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