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132-PGM13038-10

132-PGM13038-10

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Manufacturer Part
132-PGM13038-10
Manufacturer
Aries Electronics, Inc.
Description
PIN GRID ARRAY SOCKET/HEADER
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
0743
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:PGM
Package:-
Part Status:Active
Type:PGA
Number of Positions or Pins (Grid):-
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:-
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass
Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature:-

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