| Type | Description |
|---|---|
| Series: | 510 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | PGA |
| Number of Positions or Pins (Grid): | 324 (18 x 18) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 29.5µin (0.75µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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110-13-304-61-001000Mill-Max |
CONN IC SKT DBL |
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517-87-320-19-131111Preci-Dip |
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40-6518-10EAries Electronics, Inc. |
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APA-624-G-CSamtec, Inc. |
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210-44-306-41-001000Mill-Max |
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In Stock: 0 $11.30403 |
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210-99-306-41-001000Mill-Max |
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In Stock: 0 $11.30403 |
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550-80-144-15-081101Preci-Dip |
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550-80-144-12-000101Preci-Dip |
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