| Type | Description |
|---|---|
| Series: | 8 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.2" (5.08mm) Row Spacing |
| Number of Positions or Pins (Grid): | 10 (2 x 5) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame, Elevated |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -55°C ~ 105°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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10-8875-210CAries Electronics, Inc. |
CONN IC DIP SOCKET 10POS GOLD |
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12-81250-610CAries Electronics, Inc. |
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12-8260-610CAries Electronics, Inc. |
CONN IC DIP SOCKET 12POS GOLD |
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12-8300-610CAries Electronics, Inc. |
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In Stock: 0 $7.89786 |
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612-93-304-41-001000Mill-Max |
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In Stock: 0 $7.91059 |
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12-0501-21Aries Electronics, Inc. |
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In Stock: 0 $7.91200 |