Type | Description |
---|---|
Series: | 714 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, 0.1" (2.54mm) Row Spacing |
Number of Positions or Pins (Grid): | 28 (2 x 14) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Carrier, Closed Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 30.0µin (0.76µm) |
Contact Material - Post: | Brass Alloy |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Operating Temperature: | -55°C ~ 125°C |
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550-80-084-13-081101Preci-Dip |
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36-0511-10Aries Electronics, Inc. |
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20-9513-10HAries Electronics, Inc. |
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10-3503-21Aries Electronics, Inc. |
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10-3503-31Aries Electronics, Inc. |
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14-3508-201Aries Electronics, Inc. |
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14-3508-301Aries Electronics, Inc. |
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