| Type | Description |
|---|---|
| Series: | APA |
| Package: | Bulk |
| Part Status: | Active |
| Type: | - |
| Number of Positions or Pins (Grid): | 18 (2 x 9) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 20.0µin (0.51µm) |
| Contact Material - Mating: | Phosphor Bronze |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 20.0µin (0.51µm) |
| Contact Material - Post: | Phosphor Bronze |
| Housing Material: | Polybutylene Terephthalate (PBT), Glass Filled |
| Operating Temperature: | - |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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20-3518-11HAries Electronics, Inc. |
CONN IC DIP SOCKET 20POS GOLD |
In Stock: 0 $6.76211 |
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116-83-632-41-013101Preci-Dip |
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In Stock: 0 $6.78529 |
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In Stock: 0 $6.78951 |
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In Stock: 0 $6.78951 |
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23-0511-10Aries Electronics, Inc. |
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In Stock: 0 $6.80824 |
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12-822-90CAries Electronics, Inc. |
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In Stock: 0 $6.80824 |