| Type | Description |
|---|---|
| Series: | 510 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | PGA |
| Number of Positions or Pins (Grid): | 243 (19 x 19) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | Flash |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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22-0511-10Aries Electronics, Inc. |
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08-81250-210CAries Electronics, Inc. |
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08-8255-210CAries Electronics, Inc. |
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08-8300-210CAries Electronics, Inc. |
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08-8343-210CAries Electronics, Inc. |
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08-8430-210CAries Electronics, Inc. |
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08-8460-210CAries Electronics, Inc. |
CONN IC DIP SOCKET 8POS GOLD |
In Stock: 0 $6.64722 |
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08-8550-210CAries Electronics, Inc. |
CONN IC DIP SOCKET 8POS GOLD |
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08-8620-210CAries Electronics, Inc. |
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714-43-224-31-018000Mill-Max |
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In Stock: 0 $6.66000 |